Hi Maurice,
A few comments and observations:
1) You didn't apply displacement boundary conditions, so your model floats freely in space. Most FEM packages would crash, but CCX is very forgiving
2) There is no heat sink in your model so the whole model "heats up" to a final steady state solution of 300K, which is the temperature applied to the surface of one of your copper chips:
- Thermo Mechanical.png (307.49 KiB) Viewed 5505 times
3) The coefficient of thermal expansion of the PCB board is 0, so only the copper chips expand, causing outward forces at the top surface of the board, which explains why it curves upward.
4) In the Simscale analysis the authors apply heat sources at all chips on the board and show the transient evolution of temperatures across the board. No steady state solution is reached.
Harry
