Hi I am using version FreeCAD 0.17
I am trying to simulate the thermo-mechanical stress of a copper interconnect surrounded by silicon as outlined in the attached pdf.
Due to both materials have different coefficients of thermal expansion a mechanical stress is developed.
Basically I need to model the stress as the process cools from 400C to 25C.
1. How do you model nanoscale geometry.
2. Do the materials need to be joined/connected. Boolean Fragments or other?
3. The only boundary condition needed is the cylinder center line.
Any help/guidance appreciated.
Regards,
Barry.
Thermo-Mechanical Stress Simulation
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Thermo-Mechanical Stress Simulation
- Attachments
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- FEA of TSV Structure.pdf
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